SPECIFICATIONS

Balls Alloy: Sn63/Pb37
Brand Name: NoEnName_Null
Choice: yes
Condition: Brand New
High-concerned chemical: None
Model Number: XT2024081604IFANYUO
Origin: Mainland China
Quantity: 25,000PCS per Bottle
Size: 0.2mm~0.65 mm
Standard: for RoHs Available for SGS Tested
semi_Choice: yes



Description:

25000pcs BGA Reballing Balls 0.2-0.65mm Solder Ball Leaded for Micro Welding Mobile Phone Repair Tools Soldering Solder Ball Kit

Specifications:

Size: 0.2mm~0.65 mm

Quantity: 25,000PCS per Bottle

Condition: Brand New

Balls Alloy: Sn63/Pb37

Standard: for RoHs Available for SGS Tested

Feature:

Brand new and high quality.

Solder (Tin) paste is the best choice of reballing IC.

It is used instead of the pin in the IC component package structure.

Please Note: There are 25000Pcs/Bottle.The size of the bottle is fixed.The bigger the Reballing Balls, the more loaded it is.If it is a small Reballing balls, the product will only occupy a small space for the bottle.

Package Included:

1PC Reballing Balls

Note:

-Due to hand measure, the size may have 0.5-1 cm error

-Due to Different Monitor, the color may have difference

-Due to long shipping, the item may damage in transit, if the item damage, pls contact us firstly immediately before leave feedback, thanks for your understanding IFANYUO.